Description
Building off the success of the first generation, AMD has evolved the multi-die strategy, as the company now focused on a different form of multi-die packaging solutions in the second generation EPYC server processor. This new solution, which AMD refers to as hybrid multi-die, allows AMD to not only divide a potentially large die into small interconnected dies, but also specific functions can be fabricated in the most appropriate process node based on required cost and performance. This agile hybrid multi-die architecture decoupled the CPU and cache complex and I/O innovation paths, giving AMD the ability to deliver the best process technology for CPU cores and letting I/O circuitry develop at its own rate.
