Semiconductors
Silicon architecture, process nodes, and competitive positioning across the value chain.
Research Library
Published forecasts and white papers from the TIRIAS Research team — independent reports and clearly labeled sponsored work. Our freshest analysis publishes continuously in TIRIAS Insight.
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Forecasting the Growth of Generative AI Usage, Compute Requirements, and Infrastructure Costs
The Tirias Research GenAI FTCO Service provides insight into the demand, compute requirements, compute capacity, and TCO of generative AI inference. The forecast and TCO model incorporate extensive knowledge of silicon performance and roadmaps, data center operational cost models, application benchmarks, and market research. Service customers employ the model to build scenarios at multiple layers, driving their product and corporate strategy.
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Coverage Areas
Silicon architecture, process nodes, and competitive positioning across the value chain.
Compute capacity, power constraints, TCO modeling, and capital deployment for AI at scale.
Defense programs, SATCOM, resilient navigation, and program execution from proposal to O&M.
Server platforms, accelerators, and the economics of hyperscale build-outs.
Scale-up and scale-out fabrics, optics, and the bandwidth demands of AI clusters.
Foundry roadmaps, advanced packaging, and semiconductor supply chain dynamics.
Design tooling, IP ecosystems, and the methodology shifts reshaping silicon development.
Qubit modalities, error-correction milestones, and the road to commercial advantage.
Sector positioning, M&A evaluation, and investment thesis development for allocators.
AI & ML
7 reports
AI & ML
IndependentGenerative AI Inference Demand and the Global Compute Build-Out
Examines the rapid expansion of generative AI inference demand and its implications for global compute infrastructure as the market shifts from consumer AI adoption to agentic workloads, real-time media, and multimodal interaction. A multi-wave framework connects innovation cycles to user demand, output volume, accelerator requirements, data center power and cooling, and total cost of operation.
AI & ML
IndependentTools and IP Transform Low-Power FPGAs into Intelligent AI/ML Edge Computing Engines
Explores how the Lattice sensAI 4.1 solution stack expands developers' abilities to use Lattice FPGAs for edge AI/ML applications, enabling intelligent edge computing at low power.
AI & ML
IndependentExplores how Edge Impulse accelerates MLOps using new EON capabilities for machine learning on low-power embedded devices.
AI & ML
IndependentExplores how new software tools allow designers to add machine learning capabilities to any edge embedded system, lowering the barrier to intelligent edge computing.
AI & ML
IndependentThe Wave of Perceptive Electronics Powered by Machine Learning
Covers the Perceive Ergo inference processor for small, low-power consumer devices, examining the architectural choices enabling on-device ML inference.
AI & ML
IndependentExplores seven major AI and deep learning challenges: Programmability, Latency, Accuracy, Size of Model, Throughput, Energy Efficiency, and Rate of Learning. A framework for evaluating deep learning infrastructure investments.
AI & ML
IndependentCovers the Dell EMC and NVIDIA Volta joint development agreement, examining how enterprise infrastructure vendors are positioning for AI and ML workload growth.
Semiconductors
4 reports
Semiconductors
IndependentCovers AMD's hybrid multi-die architecture and its impact on server processor design, analyzing cache hierarchy, memory bandwidth, and platform economics.
Semiconductors
IndependentEmbedded Vision Processing at the Edge
Covers Lattice CrossLinkPlus FPGAs for embedded vision applications at the edge, detailing performance-per-watt advantages for computer vision inference workloads.
Semiconductors
IndependentCovers the second-generation EPYC Rome processor launch, with detailed analysis of performance per dollar, memory bandwidth, and impact on hyperscale and enterprise TCO.
Semiconductors
IndependentCovers AMD EPYC memory design balancing cost, die area, bandwidth, and latency using MCM and Infinity Fabric, with implications for HPC and enterprise workload placement.
Cloud & Infrastructure
2 reports
Cloud & Infrastructure
Sponsored · NETINTTCO and environmental impact model comparing software on CPU, GPU, and ASIC approaches for interactive streaming services. Quantifies operational and capital efficiency across deployment architectures.
Cloud & Infrastructure
Sponsored · NETINTCovers infrastructure for mobile streaming using Arm-based servers, virtualized multi-user graphics, and high-performance low-latency video streaming. Analyzes the supply chain and capital requirements for cloud gaming at scale.
5G & Wireless
2 reports
5G & Wireless
Sponsored · QualcommWhat it Means for Consumers
Addresses the challenges of lossless and hi-res audio across the wireless audio chain, exploring technical constraints and the consumer experience impact.
5G & Wireless
Sponsored · NGCodecEmerging Consumer Applications of 5G Wireless Networks
Covers how 5G enables cloud edge computing for streaming high-performance graphics experiences, modeling latency requirements and infrastructure build-out implications.
Data Center
1 report
Data Center
IndependentAnalysis of Ampere Computing's Arm-based cloud server offerings, examining TCO, performance density, and competitive positioning against x86 incumbents.
Automotive
2 reports
Automotive
IndependentCovers integration of Arm's IP library into the Siemens PAVE360 digital twin simulation platform, examining implications for automotive chip development timelines and validation costs.
Automotive
IndependentCovers closed-loop simulation platforms for autonomous and mechatronic systems, examining how silicon-level validation is compressing AV development cycles.
Custom Engagements